About

1980s

The facility opened in 1981 as part of Nortel Networks’ hybrid microcircuits component manufacturing. This business unit started with fabricating ceramic substrates using the thick film process. Later, it evolved to populating these ceramic substrate assemblies with surface mount components. The operation later expanded and introduced automated SMT assembly, which substantially improved quality and throughput while reducing assembly costs.

1990s

In 1991, the business unit was sold to C-MAC Industries. The operation expanded into HDI, chip scale packaging (CSP), flip chip, and chip-on-board utilizing different substrate technologies (rigid epoxy, flex, rigid flex, package-on-package, and metal (IMS) printed circuit boards). The operation attained ISO 9001 and QS 9000 (ISO/TS 16949) registrations.

2000s

In 2001, the business unit was sold to Solectron as the telecom and technology industries declined. This began a period of significant reorganization and restructuring. The operation shifted its focus towards greater integration of electro-mechanical products. Solectron was later sold to Flextronics in 2007.

In 2005, the business unit managers acquired the West Palm Beach operation and started Florida MicroElectronics (FME). We offered customers SMT assembly, thick-film products, and electro-mechanical assemblies. Initial customers included Delphi, Redbox, and MediWatch. FME received ISO 13485 registration for medical device quality management.

2010s

With the engineering relationships developed with Redbox and Flextronics, FME continued to expand its customer base and capabilities in electro-mechanical assemblies, fabricating kiosks for sampling packages and library kiosks that dispense DVDs.  FME and Flextronics co-developed major automation projects involving conveyors, material handling, and assembly for apparel fabrication.

In the latter part of the decade, we began working with many of the aerospace & defense, automotive, commercial & industrial, consumer, and medical device companies we work with today. Our work was diversified across PCB assembly, thick film substrates, and systems assembly.

2020s

FME came under new ownership and was rebranded as Forte Micro. We are excited to work with you for your “Made in USA” needs.

The Present

Our 60,000 ft² facility offers a wide range of design, engineering, manufacturing, automation, and testing solutions to support our customers’ products from initial concept to design to prototype to design validation to testing and then to volume production.

Forte Micro utilizes the knowledge, experience, and expanded capabilities developed over the past 30 years to design and manufacture the highest quality products for our customers.